THT (Through-Hole Technology) is a classic and critical assembly process in PCBA manufacturing. Its core principle involves inserting the metal leads of electronic components through pre-drilled holes in the PCB substrate, followed by soldering and fixing on the other side of the substrate to form a dual structure with both electrical connection and mechanical fixation. Compared with SMT (Surface Mount Technology), THT boasts irreplaceable mechanical strength, vibration resistance, and power-carrying capacity due to its unique "physical penetration + solder filling" design. It is particularly suitable for electronic devices that require long-term stable operation and resistance to harsh environments (high temperature, vibration, high pressure). Despite the miniaturization trend of electronic products, THT remains an indispensable core process in high-reliability and high-power scenarios, widely serving industries such as industrial control, automotive electronics, aerospace, and power supply equipment.
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Component leads penetrate the PCB and are fixed by soldering, with connection strength far exceeding surface mounting, featuring excellent vibration and shock resistance.
Full solder filling ensures stable electrical connection and low failure rate, suitable for industrial-grade equipment requiring long-term operation.
Compatible with high-power and high-voltage components, with excellent heat dissipation performance to avoid performance degradation caused by high temperature.
Supports special-shaped components, large-sized components and special package devices, making up for the limitations of SMT process in assembling special components.
| ltem | Capability |
|---|---|
| Automatic Insertion (AI) Positioning Deviation | ≤±0.05mm |
| Insertion Angle Deviation | ≤±1° |
| Manual Insertion (MI) Accuracy | ≤±0.1mm. |
| Solder Fill Rate | ≥75% (IPC-2 ) |
| Solder Joint Wetting Angle | ≤45° |
| Lead Trimming Length | 0.8-2.5mm (tolerance ±0.1mm) |
| Package Types | Axial leads, Radial Leads, DIP, PGA, etc. |
| Wave Soldering Temperature Control | Preheating Temperature Precision ±5℃, Peak Temperature Control ±1.0℃, Lead-free soldering (Sn-Ag-Cu) with a peak temperature of 245±5℃. |
| Special Components | Compatible with Moisture-Sensitive Devices (MSD), Ensuring assembly reliability through dry cabinet storage (≤10% RH). Professional baking processes. |
| Manual Touch-Up Soldering | Provides IPC-standard manual soldering services for special-shaped components, Small-batch orders or rework needs, Ensuring consistent solder joint quality. |
Equipped with 10-12 zone preheating system, turbulent wave removes oxide layer, laminar wave ensures solder filling, supporting quick switch between lead-free/lead soldering.
Humidity control ≤10% RH, used for MSD component storage to prevent soldering failure caused by component moisture absorption.
Staffed by professionals, equipped with strict ESD protection, and adhering to rigorous SOPs—delivers consistent, high-reliability through-hole assemblies.