Flexible Printed Circuit (FPC) and Rigid-Flex Printed Circuit Board (Rigid-Flex PCB) are high-end interconnection carriers adapting to the trends of miniaturization, lightweight and bendability of electronic devices. FPC uses polyimide (PI) or polyester (PET) as the base material, with excellent flexible bending performance; Rigid-Flex PCB is integrally laminated and formed by rigid areas (FR-4, etc.) and flexible areas (PI base material), which has both the structural stability of rigid boards and the space adaptability of flexible boards, enabling complex 3D assembly and greatly simplifying the internal connection structure of products. Both provide high-density and high-reliability signal transmission solutions for high-end electronic devices through precision circuit manufacturing and interlayer interconnection technology.