This Industrial Communication Board is an 8-layer PCB specifically engineered for robust industrial environments. Measuring 190mm*170mm with a 1.7mm thickness, it utilizes advanced TU-862+RO4350B materials for superior performance. Key features include precise impedance control, ENIG surface treatment for excellent connectivity, and non-conductive filled, copper-capped vias, ensuring high signal integrity and reliability for critical communication applications. It supports both SMT and DIP assembly methods.
Engineered as an 8-layer board with advanced TU-862+RO4350B materials, ensuring exceptional durability and signal integrity in challenging industrial settings.
Features precise impedance control and non-conductive filled, copper-capped vias to maintain superior signal integrity and minimize data loss for critical communication.
Utilizes Electroless Nickel Immersion Gold (ENIG) surface treatment, providing excellent solderability, a flat surface, and enhanced corrosion resistance for long-term reliability.
Designed specifically for industrial communication applications with flexible SMT+DIP assembly, delivering reliable operation in diverse industrial environments.
| PCB Type | 8L Board |
| Dimension | 190mm*170mm |
| Board Thickness | 1.7mm |
| Material | TU-862+RO4350B |
| Copper | 1/0.5/0.5/0.5/0.5/0.5/0.5/1OZ |
| Solder mask | Matt Green |
| Silkscreen | White |
| Surface Treatment | ENIG |
| Impedance Control | Yes |
| Via Filling | Non-conductive filled, copper capped |
| Assembly | SMT+DIP |
| Application | Industrial Communication |
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Tel: 0086-755-2664 8283
E-mail: info@fully-hong.com
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