The POFV Board is a high-performance 2-layer printed circuit board engineered for reliability and advanced functionality. Featuring a robust FR4-TG170 material and 2OZ copper, it ensures excellent thermal stability and enhanced current carrying capacity. The board utilizes Plated Over Filled Vias (POFV) technology for improved signal integrity and increased component density, complemented by a premium ENIG surface finish for superior solderability and long-term durability in demanding applications.
Advanced Plated Over Filled Vias (POFV) technology optimizes signal transmission, reduces parasitic capacitance, and allows for finer pitch components, leading to more compact and higher-performing designs.
Constructed with FR4-TG170 material for exceptional thermal resistance and stability, combined with 2OZ copper for robust power delivery and efficient heat dissipation.
The Electroless Nickel Immersion Gold (ENIG) surface treatment provides excellent solderability for fine-pitch components, ensures outstanding flatness, and offers long-term corrosion resistance, extending product lifespan.
With a 1.2mm board thickness and high-grade materials, this 2-layer POFV board offers enhanced mechanical strength and reliability, making it suitable for a wide range of critical electronic applications.
| PCB Type | 2L Board |
| Panel | 1*4 |
| Board Thickness | 1.2mm |
| Material | FR4-TG170 |
| Copper | 2OZ |
| Solder mask | Green |
| Silkscreen | White |
| POFV | Plated Over Filled Vias |
| Surface Treatment | ENIG |
Add: 803-804, Hisee International Commercial Center, Dongbin Road, Nanshan District, Shenzhen, China
Tel: 0086-755-2664 8283
E-mail: info@fully-hong.com
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