The 8L POFV Board is a high-performance printed circuit board engineered with an 8-layer design and a robust 1.2mm FR4 substrate. It features a substantial 2OZ copper thickness and advanced Plated Over Filled Vias (POFV) technology, ensuring enhanced reliability and signal integrity for high-density applications. The board is finished with a green solder mask, white silkscreen, and Electroless Nickel Immersion Gold (ENIG) surface treatment for superior solderability and corrosion resistance.
Offers complex circuit routing and high component density, making it ideal for sophisticated electronic applications requiring intricate interconnections.
Enhances reliability, signal integrity, and enables finer pitch component placement by providing a perfectly flat surface over filled vias, improving assembly yield.
Provides excellent current carrying capacity, superior thermal management, and mechanical stability, crucial for demanding environments and high-power applications.
Ensures exceptional solderability, planarity, and corrosion resistance, vital for fine-pitch component assembly (e.g., BGA) and long-term performance in various operating conditions.
| PCB Type | 8L Board |
| Board Thickness | 1.2mm |
| Material | FR4 |
| Copper | 2OZ |
| Solder mask | Green |
| Silkscreen | White |
| POFV | Plated Over Filled Vias |
| Surface Treatment | ENIG |
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