This is a robust 14-layer Heavy Copper Board designed for high-performance applications. Manufactured with FR4 material and a high Tg of 170, it ensures excellent thermal stability and reliability. All layers feature a substantial 3OZ copper weight, facilitating superior current handling capabilities. With a board thickness of 3.5mm and a minimum hole size of 0.5mm, it supports complex designs while maintaining structural integrity. The board is finished with ENIG (Electroless Nickel Immersion Gold) surface treatment, providing excellent solderability and long-term reliability.
All layers feature 3OZ heavy copper, ideal for power-intensive applications requiring robust current distribution and thermal management.
Built with high Tg170 FR4 material, this board ensures reliable performance and longevity even under demanding thermal conditions.
A 14-layer design combined with a 3.5mm board thickness allows for sophisticated and compact circuit routing, accommodating intricate designs.
The ENIG surface treatment provides a flat, highly solderable surface, excellent environmental protection, and long-term reliability for critical connections.
| PCB Type | 14-layer Heavy Copper Board |
| Material | FR4, High Tg170 |
| Board Thickness | 3.5mm |
| Copper | all layers 3OZ |
| Min. Hole | 0.5mm |
| Surface Treatment | ENIG |
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