This is a high-performance 12-layer HDI (High-Density Interconnect) Printed Circuit Board, meticulously engineered for demanding electronic applications. It utilizes robust FR4 Tg180 material, ensuring superior thermal stability and reliability, with a compact 2.0mm board thickness. The design incorporates advanced blind hole technology (L1-L3, L1-L4, L7-L12, L9-L12) to maximize routing density and improve signal integrity. A fine minimum hole size of 0.2mm accommodates ultra-fine pitch components, while the ENIG (Electroless Nickel Immersion Gold) surface treatment guarantees excellent solderability, a flat surface, and corrosion resistance for long-term reliability.
Featuring a 12-layer stack-up with intricate blind hole structures (L1-L3, L1-L4, L7-L12, L9-L12), this board achieves significantly higher component density and more complex circuitry in a compact form factor, ideal for advanced, miniaturized electronic devices.
Constructed with FR4 Tg180 material, the PCB offers exceptional thermal performance and reliability, ensuring stable operation and extended lifespan in high-temperature environments and demanding industrial applications.
The precise 0.2mm minimum hole size coupled with advanced blind via technology optimizes signal routing, minimizes impedance discontinuities, and enables ultra-fine pitch component placement, crucial for high-speed designs and compact product development.
Utilizing Electroless Nickel Immersion Gold (ENIG) surface treatment, the board provides excellent solderability, a perfectly flat co-planar surface for fine-pitch components, and superior corrosion resistance, significantly contributing to overall product quality and reliability.
| PCB Type | 12-layer HDI Board |
| Material | FR4 Tg180 |
| Board Thickness | 2.0mm |
| Blind holes | L1-L3, L1-L4, L7-L12, L9-L12 |
| Min. Hole | 0.2mm |
| Surface Treatment | ENIG |
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Tel: 0086-755-2664 8283
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