This is an 8-layer BGA+Gold Finger Board designed for complex electronic applications requiring high-density interconnects and reliable edge connectivity. Constructed from durable FR4 material with a robust 2.0mm thickness, it features precise 0.25mm plugged vias and a minimum 0.1mm solder dam for excellent manufacturing yield. The board boasts a premium surface treatment of ENIG (Electroless Nickel Immersion Gold) combined with gold plated fingers, ensuring superior signal integrity, exceptional corrosion resistance, and stable electrical contact for critical interface connections.
An 8-layer board specifically supporting BGA (Ball Grid Array) components, enabling highly complex and compact electronic designs with superior signal routing capabilities.
Features durable Gold Plated Fingers, ensuring robust and long-lasting electrical contact for edge connectors, crucial for modules requiring frequent insertion/removal or high reliability.
Utilizes ENIG (Electroless Nickel Immersion Gold) and Gold Plated Fingers for surface treatment, offering excellent solderability, superior corrosion resistance, and high signal integrity, optimizing performance and lifespan.
Built on a reliable FR4 material with a substantial 2.0mm thickness, incorporating precise 0.25mm plugged vias and a tight 0.1mm minimum solder dam, guaranteeing high manufacturing quality and mechanical stability for demanding applications.
| PCB Type | 8L BGA+Gold Finger Board |
| Material | FR4 |
| Board Thickness | 2.0mm |
| Plugged vias | 0.25mm |
| Min. solder dam | 0.1mm |
| Surface Treatment | ENIG, Gold plated Finger |
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Tel: 0086-755-2664 8283
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