This is a high-performance 4-layer FR4 PCB featuring an Electroless Nickel Immersion Gold (ENIG) surface finish. With a robust 1.6mm board thickness and 2OZ copper, it ensures excellent electrical conductivity and mechanical stability. Its fine line capabilities, including a minimum trace width and space of 3mils, combined with a precise 2.5u'' Au thickness, make it ideal for advanced electronic applications requiring high density, superior signal integrity, and reliable solderability.
The 4-layer design significantly increases circuit density, allowing for more complex layouts and improved functionality within a compact footprint.
Electroless Nickel Immersion Gold (ENIG) treatment provides exceptional flatness, excellent solderability for fine-pitch components, and robust corrosion resistance.
Featuring a minimum trace width and space of 3mils, this PCB supports highly precise routing for advanced and compact electronic designs.
Built with durable FR4 material and 2OZ copper, this board offers excellent mechanical strength and superior electrical performance, ensuring long-term reliability.
| PCB Type | 4 Layer ENIG Board |
| Material | FR4 |
| Board Thickness | 1.6mm |
| Copper | 2OZ |
| Min. Width & Space | 3mils |
| Au thickness | 2.5u’’ |
| Surface Treatment | ENIG |
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