This 10-layer Impedance Board is engineered for high-performance applications, built on robust FR4 material with a standard 1.6mm thickness. It features precise 50Ω±8% impedance control, crucial for maintaining signal integrity in high-speed circuits. The board also includes plugged vias for reliable BGA component mounting and is finished with an ENIG (Electroless Nickel Immersion Gold) surface treatment, ensuring excellent solderability and durability.
Supports complex circuitry and high component density, making it ideal for advanced electronic applications requiring multiple routing layers.
Guarantees optimal signal integrity and minimal data loss, critical for high-frequency and high-speed digital designs.
Enhances solder joint reliability and improves signal routing capabilities by filling unused vias, especially important for fine-pitch BGA components.
Provides excellent flatness, solderability for fine-pitch components, and corrosion resistance, contributing to a longer shelf life and robust electrical performance.
| PCB Type | 10-layer Impedance Board |
| Material | FR4 |
| Board Thickness | 1.6mm |
| BGA | Plugged vias |
| Impedance Control | 50Ω±8% |
| Surface Treatment | ENIG |
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