This 8-layer PCB is specifically engineered for robust industrial communication applications, ensuring high reliability and stable performance. Constructed with durable FR4 material, it features a compact design with dimensions of 174.52mm*121.25mm and a standard 1.60mm thickness. The board incorporates 1OZ copper, a blue solder mask, white silkscreen, and ENIG (Electroless Nickel Immersion Gold) surface treatment, providing excellent signal integrity and corrosion resistance. Its versatile design supports both SMT (Surface Mount Technology) and DIP (Dual In-line Package) assembly methods, making it suitable for complex integration requirements.
Designed as an 8-layer board with FR4 material and ENIG surface treatment, this PCB offers exceptional stability and durability, making it ideal for demanding industrial communication systems.
Featuring 1OZ copper and a premium ENIG finish, the board ensures superior electrical conductivity, enhanced signal integrity, and reliable connections crucial for critical communication data.
With support for both SMT and DIP assembly, this PCB provides significant flexibility for component integration and manufacturing processes, accommodating a wide range of design complexities.
Measuring 174.52mm*121.25mm with a sturdy 1.60mm thickness, the board offers a space-efficient solution without compromising on the physical strength and long-term operational resilience required in industrial settings.
| PCB Type | 8L Board |
| Dimension | 174.52mm*121.25mm |
| Board Thickness | 1.60mm |
| Material | FR4 |
| Copper | 1OZ |
| Solder mask | Blue |
| Silkscreen | White |
| Surface Treatment | ENIG |
| Assembly | SMT+DIP |
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