This 8-Layer FR4 High-Density PCBA offers robust performance for complex electronic applications. With a 1.60mm board thickness, 1OZ copper, blue solder mask, and white silkscreen, it's finished with ENIG surface treatment for excellent reliability. The board integrates both SMT and DIP assembly, ensuring comprehensive component support in a compact 165.50mm*25.90mm dimension, making it ideal for demanding high-density solutions.
The 8-layer FR4 construction enables complex circuit routing within a compact footprint, perfect for sophisticated electronic devices requiring high integration.
Features Electroless Nickel Immersion Gold (ENIG) surface treatment, providing excellent solderability, flatness, and long-term reliability for critical applications.
Supports both Surface Mount Technology (SMT) and Dual In-line Package (DIP) assembly methods, accommodating a wide range of component types and design complexities.
Built with durable FR4 material and a standard 1.60mm board thickness, ensuring mechanical stability and electrical integrity for consistent and lasting operation.
| PCB Type | 8L Board |
| Dimension | 165.50mm*25.90mm |
| Board Thickness | 1.60mm |
| Material | FR4 |
| Copper | 1OZ |
| Solder mask | Blue |
| Silkscreen | White |
| Surface Treatment | ENIG |
| Assembly | SMT+DIP |
Add: 803-804, Hisee International Commercial Center, Dongbin Road, Nanshan District, Shenzhen, China
Tel: 0086-755-2664 8283
E-mail: info@fully-hong.com
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