This 10-layer FR4 Rigid PCB with POFV is specifically designed for high-speed industrial applications. It features a robust 2.0mm board thickness and 1OZ copper on all layers, ensuring excellent electrical and mechanical performance. Key features include BGA support, a fine 0.15mm minimum hole dimension, and advanced Plating Over Filled Vias (POFV) technology for enhanced signal integrity and reliability. An ENIG surface treatment further optimizes its solderability and durability in demanding industrial environments.
With 10 layers, BGA support, and a minimum hole dimension of 0.15mm, this PCB is engineered to handle highly complex and dense circuit designs required for advanced industrial electronics.
Utilizing Plating Over Filled Vias (POFV) technology, the board significantly reduces signal loss and impedance variations, ensuring optimal performance for high-speed data transmission in critical industrial systems.
Built with a sturdy 2.0mm FR4 board thickness, 1OZ copper on all layers, and an ENIG surface finish, this PCB offers exceptional durability, thermal management, and long-term reliability in harsh industrial conditions.
Specifically tailored for high-speed industrial uses, this PCB provides a stable and efficient platform for demanding control systems, automation equipment, and other high-performance industrial applications.
| PCB Type | 10L Rigid FR4 Board |
| Board Thickness | 2.0mm |
| Copper Thickness | All layers 1OZ |
| Solder Mask | Black |
| Silkscreen | White |
| Surface Treatment | ENIG |
| Key Features | BGA support, 0.15mm minimum hole dimension, POFV (Plating Over Filled Vias) process |
| PCB Fabrication Process | Inner Layer -- Dry Film -- Exposure -- Develop -- Etch -- Strip -- Stack up & Laminate -- Drill -- PTH & Panel Plating -- Dry Film -- Outer pattern transfer -- Solder mask -- Surface Finish --- E-test |
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