This high-performance 6-layer FR4 PCB is meticulously engineered for demanding industrial applications. Built with a high-Tg 170 FR4 material, a 1.6mm board thickness, and 1OZ copper on all layers, it ensures exceptional reliability and excellent signal integrity. The board features an ENIG surface treatment and durable 2 microinches gold fingers for superior connectivity, while stringent quality control ensures no X-out panels are accepted.
Utilizes high-Tg 170 FR4 material, ensuring stable performance and longevity even in high-temperature industrial environments.
The 6-layer stack-up with 1OZ copper on all layers provides superior routing flexibility, improved signal integrity, and robust power distribution for complex industrial circuits.
Features ENIG surface treatment and 2 microinches gold fingers, offering excellent solderability, corrosion resistance, and highly reliable contact points for critical connections.
Manufactured under strict quality controls, explicitly rejecting X-out panels, ensuring every PCB meets the highest standards for performance and reliability in industrial applications
| PCB Type | 6L FR4 Tg170 Board |
| Board Thickness | 1.6mm |
| Copper Thickness | All layers 1OZ |
| Solder Mask | Green |
| Surface Treatment | ENIG |
| Gold Finger | 2 microinches gold thickness |
| Panel Requirement | X-out Panel not accepted |
| PCB Fabrication Process | Inner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Solder mask -- Surface Finish --- E-test |
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Tel: 0086-755-2664 8283
E-mail: info@fully-hong.com
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