This offering provides custom fabrication services for high-performance 6-layer FR4 PCBs. Featuring a Tg170 board with a 1.6mm thickness and 1OZ copper on all layers, these boards are finished with a sleek black solder mask and premium ENIG (Electroless Nickel Immersion Gold) surface treatment. Special capabilities include durable gold fingers and precise outline routing, ensuring reliable and high-quality circuit boards for demanding applications.
Utilizes FR4 Tg170 material with 1.6mm thickness and 1OZ copper on all layers for complex, high-reliability applications requiring enhanced thermal stability.
Electroless Nickel Immersion Gold (ENIG) ensures excellent solderability, flatness, and corrosion resistance, ideal for fine-pitch components and robust connections.
Integrated Gold Finger technology provides reliable and durable electrical contacts for edge connectors, crucial for high-mating cycle applications and enhanced signal integrity.
Offers flexible and accurate board shapes through custom outline routing, accommodating diverse product designs and optimizing space utilization.
| PCB Type | 6L FR4 Tg170 Board |
| Board Thickness | 1.6mm |
| Copper Thickness | All layers 1OZ |
| Solder Mask | Black |
| Surface Treatment | ENIG |
| Special Features | Gold Finger, Outline Routing |
| Panel Requirement | X-out Panel not accepted |
| PCB Fabrication Process | Inner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Solder mask -- Surface Finish --- E-test |
Add: 803-804, Hisee International Commercial Center, Dongbin Road, Nanshan District, Shenzhen, China
Tel: 0086-755-2664 8283
E-mail: info@fully-hong.com
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