6-Layer FR4 TG170 PCB
Customizable
6-Layer FR4 TG170 PCB

Product Description

This advanced 6-layer FR4 PCB is engineered with a high Tg170 material, ensuring superior thermal stability and reliability under demanding conditions. It features a precise 1.6mm board thickness and uniform 1OZ copper plating across all layers for optimal signal integrity. The board boasts a professional black solder mask and ENIG (Electroless Nickel Immersion Gold) surface treatment, providing excellent solderability and long-term durability. Designed to support complex circuitry, it includes BGA support and accurate outline routing. Furthermore, its IATF16949 certification confirms its high-quality standard and suitability for critical automotive applications.

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Product Features

  •     Superior Thermal Performance
    Superior Thermal Performance

    Built with high-grade FR4 Tg170 material, this PCB delivers exceptional thermal resistance, making it perfectly suited for applications exposed to elevated operating temperatures.

  •     Automotive Industry Ready
    Automotive Industry Ready

    IATF16949 certified, guaranteeing compliance with the rigorous quality management systems required for automotive electronics, ensuring reliability and safety.

  •     Advanced Circuitry Integration
    Advanced Circuitry Integration

    Its 6-layer structure combined with BGA support and precise outline routing capabilities enables the integration of complex, high-density electronic designs.

  •     Robust & Durable Construction
    Robust & Durable Construction

    Featuring 1OZ copper on all layers and an ENIG surface finish, the PCB offers excellent electrical conductivity, superior solderability, and enhanced protection against corrosion and wear.

Product Specifications

PCB Type6L FR4 Tg170 Board
Board Thickness1.6mm
Copper ThicknessAll layers 1OZ
Solder MaskBlack
Surface TreatmentENIG
Key FeaturesBGA support, Outline Routing
Certification & ApplicationIATF16949 certified, suitable for automotive field
PCB Fabrication ProcessInner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Solder mask -- Surface Finish --- E-test

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