This is a high-performance 4-layer FR4 Tg170 PCB, specifically designed for demanding applications, particularly in the automotive field. It features a robust 1.6mm board thickness with 1OZ copper on all layers, ensuring excellent conductivity and durability. The board is finished with a sleek black solder mask and ENIG surface treatment for superior solderability and reliability. Key functionalities include BGA support and outline routing, offering flexibility for complex designs. Certified with IATF16949, this PCB guarantees automotive-grade quality and reliable performance.
Utilizing Tg170 FR4 material, this PCB offers exceptional thermal performance and reliability, making it ideal for high-temperature and demanding operating environments in critical applications.
Achieving IATF16949 certification, this PCB meets the rigorous quality and reliability standards required for the automotive industry, ensuring robust performance in vehicles and related systems.
The Electroless Nickel Immersion Gold (ENIG) surface treatment provides excellent solderability, a perfectly flat surface for fine-pitch components, and enhanced corrosion resistance, leading to high assembly yields and long-term board integrity.
With comprehensive support for Ball Grid Array (BGA) components and precise outline routing capabilities, this PCB allows for the implementation of complex and high-density designs, accommodating sophisticated electronic requirements.
| PCB Type | 4L FR4 Tg170 Board |
| Board Thickness | 1.6mm |
| Copper Thickness | All layers 1OZ |
| Solder Mask | Black |
| Surface Treatment | ENIG |
| Key Features | BGA support, Outline Routing |
| Certification & Application | IATF16949 certified, suitable for automotive field |
| PCB Fabrication Process | Inner Layer -- Drill -- PTH & Panel Plating -- Dry Film -- Exposure -- Develop -- Pattern Plating -- Tin Plating -- Dry Film Strip -- Etch -- Tin Strip -- Solder mask -- Surface Finish --- E-test |
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