This is a robust 4-layer PCBA, designed with a 1.6mm board thickness and a Tg150 laminate, making it suitable for demanding applications, including integration within power supply systems. It features integrated Bluetooth and WiFi modules, enabling versatile wireless connectivity. The assembly undergoes a comprehensive manufacturing process, including SPI, reflow, wave soldering, and extensive quality checks such as AOI, FAI, X-ray, and function testing, ensuring high reliability and performance for its intended use.
Features a robust 4-layer PCB with 1.6mm thickness and Tg150 material, ensuring thermal stability and durability for demanding environments like power supply systems.
Equipped with both Bluetooth and WiFi modules, providing essential communication capabilities for monitoring and control within various systems.
Benefits from a detailed production process including SPI, AOI, reflow, wave soldering, and hand soldering, coupled with extensive quality checks (FAI, X-ray, Function Test) for superior product reliability.
Designed to deliver stable and efficient wireless communication, making it an ideal component for integrating smart features into power supply and other critical infrastructure systems.
| PCBA Type | Wireless Connectivity PCBA (Bluetooth & WiFi) |
| PCB Structure | 4-layer PCB, 1.6mm board thickness |
| Key Components | Bluetooth module, WiFi module |
| PCBA Process | Print Paste --- SPI --- Pick up & Place components -- Reflow --- AOI --- THT --- Wave Soldering --- Hand Soldering --- Assembly --- FG Test -- QA Inspection |
| Quality Check Points | SPI, AOI, FAI, X-ray, Function Test etc. |
| PCBA Lead Time | 4-5 weeks |