Yes. For components you do not want to be placed, please simply mark them as "DNI" (Do Not Include) in your BOM list.

To optimize the timeline, we perform tasks in parallel. Once Gerber files and BOM are confirmed, we begin PCB fabrication and stencil preparation concurrently with the component procurement process. This ensures assembly can start the moment parts arrive.

We first check your Bill of Materials (BOM) against our internal inventory, which includes many low-price or free stock parts. We will provide advice on how to reduce BOM costs through part crossing (using equivalent alternatives), but all final decisions regarding part changes remain with the customer.

Yes, we provide V-scoring, special milling, and controlled-depth routing for complex mechanical requirements.

We provide an extensive range of surface treatments compliant with RoHS and IPC standards, including HASL (Leaded/Lead-Free), ENIG, ENEPIG, Immersion Silver, Immersion Tin, and OSP. For specialized functional requirements, we offer Hard Gold (Gold Fingers), Soft Wire Bondable Gold, Carbon Ink, and Selective Finishing (combining two or more finishes on a single board). All finishes are monitored for thickness and quality through X-ray fluorescence (XRF) testing.