Yes. To ensure soldering quality:

●Via Near Pad: Vias must be tented and filled with solder mask to prevent solder wicking.

●Via on Pad: Vias directly on pads must be filled with resin and plated over to create a flat surface and prevent voids.

For consigned orders, please mark each individual package with:

1.Line Number (as listed in the BOM)

2.Manufacturer’s Part Number or Customer’s Part Number

3.Quantities

Please also include a detailed packing list to help us verify and organize parts upon receipt.

A Centroid file (also known as Pick-and-Place or XY Data) is used to program automated assembly machines. It includes the Reference Designator, X and Y coordinates, Rotation, and Board Side (Top or Bottom) for all surface-mount components. This ensures precise and efficient automated placement.

Generally, there is no minimum order quantity (MOQ) requirement for the PCB assembly order.

Thermal management is essential for preventing component failures and reducing the lifespan of the board. Designers must consider factors such as component power dissipation, heat transfer mechanisms, and ambient temperature conditions to ensure effective heat dissipation and avoid potential hotspots.